1. On August 1-2, 2015, Hampoo held a seminar on the subject of the midyear summary and strategy and execution at the Westin Hotel Nanshan Shenzhen. The meeting summed up the Company and each division’s business objectives target, and the progress of work plan of the first half of 2015, and to discuss the long-term strategic goal of the Company and its business unit and the second half of the business strategy and action plan. It has laid a solid foundation for the company's rapid development.


    Finally, each business unit had a "clap for the alliance, a word of wine Ding" performance commitments and action ceremony. It drew a perfect ending for the strategy and the implementation seminar.
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  2. Mr. Douglas S Clark, head of Chemical school, University of California-Berkeley visited Hampoo for cooperation on 29 June, 2015. Hampoo CEO Mr. Star Wang warmly welcomed their visiting and introduced our current situation; its 12 years development history; the mission and future development strategy. Star also presented our three business units including: advanced PCB layout service, flexible electronics manufacturing service, Smart electronic solution, and its development in the Internet of Things, Industrial 4.0 and intelligent hardware.

    Mr. Douglas S Clark highly praised our year’s continuous investment on the R&D and technology; focus on the quality; standard management and serving more than 3000 customers globally. We both hope to combine Hampoo’s intelligent hardware platform and collaborative eco-system with advanced R&D, technology from UC Berkeley. With the incubation of venture investments from home and abroad to make the advanced technology get commercialized.
                                     

    About Hampoo:
    Hampoo was founded in year 2003 as a high-tech enterprise which research, development and innovation for various electronic products, and devoted to be a global leading electronic product and service provider. Hampoo, base in Shenzhen, offers one stop electronic manufacturing service for customers, including PCB design, pcb fabrication, PCB assembly and pcb components sourcing. With over 12 years experience, Hampoo has gained a lot customers on the strength of excellent service and bespoke service.

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  3. What is Design for Manufacturing? The brief description according to wikipedia.com is that DFM is the general engineering art of designing products in such a way that they are easy to manufacture. The basic idea exists in almost all engineering disciplines, but of course the details differ widely depending on the manufacturing technology.DFM is intended to prevent:
    • Product designs that simplify assembly operations but require more complex and expensive components
    • Designs that simplify component manufacture while complicating the manufacture process
    • Designs that are simple and inexpensive but are difficult or expensive to service and support
    What needs to be added and what needs to be removed, two great Design for Manufacturing questions. 

    Design for Manufacturing looks to:
    • Reduce Material, Overhead, and Labor Cost
    • Shortens the product development cycle
    • Focus on standards to reduce cost
    Key Principles in the DFM process:
    • Minimize Part Count
    • Standardize Parts and Materials
    • Create Modular Assemblies
    • Design for Efficient Joining
    • Minimize re-orientation of parts during Assembly and/or Machining
    • Simplify and Reduce the number of Manufacturing Operations
    • Specify ‘Acceptable’ surface Finishes for functionality
    Hampoo Electronics often engages with a customer at the DFM stage. We love to start here to help a customer:
    1. Remove Cost
    2. Remove Complexity
    3. Create manufacturing to consistently achieve quality levels YOU expect
    4. Ensure you are manufacturing with a trusted source
    Our technical engineers know how to achieve the results that our customers expect! Think you are ready to engage with Hampoo Electronics to design andmanufacture your product. Any question, please email to contact@hampoo.com.

    About Hampoo:




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  4. PCB layout is the finest techniques with the highest limitation in the design process. Even the wire cloth engineers with over ten-year experience would feel poor in wiring. Having faced all kinds of problems, he knows the result for each wiring, which makes him have no idea on the wiring. But the master is still there. They have very rational knowledge, but also with some feelings of self-creation to wiring, which makes the wire have beautiful artistic sense.


    Followings are some good tips and points:

    First of all, it comes to a basic introduction, PCB layers can be divided into single, double and multi-layer. Single-layer is now basically eliminated. Two-layer board with a lot of sound systems now was used generally as a power amplifier board. Multi-layer refers to four layers and 4 layers above the plate, in general 4-layer density components for less demanding It will suffice. From the perspective of hole, it can be divided into the through-hole, blind hole, and buried hole. Through-hole is a hole is straight from the top to the bottom through; the blind hole is worn from the top or bottom of the hole to the middle layer, then do not continue to wear, this advantage is not the position of the through-hole from the beginning to the end of the block, other layers in the upper position of the hole can still trace; buried hole. Buried hole is the middle layer to the middle layer, which was buried and the surface is completely invisible. FIG details are as follows
     

     
    Before automatic wiring, interactive requirements in advance with relatively high for wiring, input and output terminals of adjacent edges should be parallel, which can avoid reflection interference. When necessary, plus ground isolation is needed and the wiring of two adjacent layers are perpendicular to each other, because the parallel more prone to parasitic coupling. Automatic routing depends on good layout, can be pre-set routing rules, such as the number of tracks, the number of holes, step number and so bent. Generally the first to explore cabling, rapid short-term connectivity, and through the labyrinth wiring, the wiring should be global routing fabric path optimization, it can disconnect the line has cloth as needed and try to re-wiring, thereby improving the overall effect of the wiring.

    For the layout, it is a principle of separate digital and analog possible to make a principle is not slow and fast approaching. The basic principle is to separate digital ground and analog ground, digital ground as are the switching device, the current in the switch of the moment are great, do not move when they very small, so the digital ground and analog ground can not be mixed together. A recommended layout can be as shown below.


     


    1 Notices on Wiring between power supply and ground

    (1)It must add decoupling capacitors between power supply and ground. Be sure to power through again after decoupling capacitors connected to the chip's pins in the figure below lists the wrong connection of several laws and a proper connection method, we refer to the following facing. Have you ever made such kind of mistake? Decoupling capacitors in general has two functions, one is to provide instant high-current chips, the second is to remove the power supply noise, on the one hand is to make the power supply to minimize noise impact chips, on the other hand is the noise generated by the chip will not affect the power supply.

     
    (2)Try to widen the power supply and the ground, which is better than the power ground line width. The relationship is: Ground> power cables> Signal line

    (3) You can use a large area of copper layer as the ground and put in place on the PCB where is not used to connect  the ground, for ground use, or made of multi-layer, power, ground floor of the occupation.


    2 Solutions tomixed digital circuits and analog circuits ?


    Now, many of PCB circuit is no longer a single function, but rather by the digital and analog circuits mixed composition, so when the wiring on the need to consider mutual interference between them, especially to line noise.



    Due to the high frequency digital circuits, analog circuits strong sensitivity of the signal line, the high-frequency signal lines should be as far as possible away from the sensitive analog circuit devices, but it is for the entire PCB, PCB ground node only to the outside world, and it is necessary to issue the PCB internal processing resolution digital circuits and analog circuits common ground, but in an internal circuit board, and analog circuits to digital circuits are physically separate, but connected with the outside world in PCB the interface (such as plugs, etc.). And analog circuits to a digital circuit is a little short, please note that only one connection point, and there are no common ground on the PCB, which is determined by the system design.



    3 Dealing with line corner
     
    Typically there will be at the corner of the line thickness changes, but when the diameter line thickness changes, will be some reflection of the phenomenon. Corner the way for changes in the thickness of the line, at right angles to the worst, 45-degree angle is better, the fillet is the best. But rounded on the PCB design in terms of handling more trouble, it is generally look at the sensitivity of the signal, and generally the signal can be a 45-degree angle, and only those who are very sensitive to the line only need to use the fillet.



    4 Checking design rules after wiring

    Whatever you do, after the completion of every inspection, just like when we test if there is time remaining to be our answer to be checked, which is an important way for us to get a high score, as we draw PCB board, too. So that we can be more sure that we draw out the circuit board is qualified products. We generally check the following aspects:

    (1) Between the lines, the line and the component pad, wire and through hole component pads and the through-hole, through-hole and through hole , are their distances reasonable and meet production requirements? 

    (2)Is the width between power line and ground appropriate? If it is tightly coupled (low impedance) between the power supply and ground, whether there can make the PCB ground widened place.  

    (3)Have you taken the best practices for critical signal cable, such as the length of the shortest line added protection, input lines and output lines are clearly separated.


    (4)For analog and digital circuit, is there separate ground wire. 

    (5)whether the PCB after adding the pattern (as shown, graphing) may cause short-circuit signal.
      
    (6)Modification to some unfavorable linear
     
    (7)Whether the PCB plus a processing line, solder meets the requirements of the production process, solder size is appropriate, the character flag is pressure pads on the device, so as not to affect the quality of electrical equipment.


    (8)For the multilayer, the frame edge of power formation is reduced, such as power strata exposed copper-board likely to cause a short circuit.

    In short, the above techniques and methods are essentials from experience, it is worth learning from the drawing board when the PCB, PCB diagram in painting process in addition to proficiency drawing tools, but also have a solid theoretical knowledge and extensive practical experience, which can help you quickly and efficiently complete your PCB Fig. But there is very important that must be careful, whether it is the wiring or the overall layout very carefully every step seriously, because of a small mistake you may cause your final product becomes waste, and also look for not what went wrong, so we'd rather spend more time drawing process of careful checking the details of a problem are reluctant to go back to check, so it may take more time. In short, the process of drawing, we should pay attention to the details of PCB.


     Attn: If you need pcb design, pcb manufacture, pcb assembly service, plz feel free to contact me. Email: contact@hampoo.com. Website:http://ems.hampoo.com


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  5. What do you need to get a quote on a PCB assembly? This is a great question and often a source of confusion. There are four basic documents and exactly how they are transmitted depends on your company’s tools; we can work together to figure out what best fits your circumstance. Here we'll explain what documents are necessary, as well as what information they should all contain, and their role in the quote process.
     
    The basic documents are:
    1. Bare Board Print
    2. Assembly Print
    3. Bill of Materials
    4. Approved Vendor List

    Bare-Board Print - Commonly referred to as a fabrication drawing or fab drawing, this print gives us the basic documents required to have your bare PCB fabricated. The bare-board print should include outer dimensions, board thickness, material, finish, number of holes along with the smallest hole size required, the number of layers required, solder-mask color one side or both, silkscreen color one side or both, and any other cost drivers. Lastly, your bare-board print should include both part number and revision. Typical file formats include gerber files, or better yet, ODB++ files.
     
    Tips: Always Check Your Data – After any and all revisions to your drawings, ensure that all necessary changes are made to your assembly print and bare-board print, and that revision numbers match on all the documents. Mismatched revision numbers are a leading cause of confusion during quoting and first-time builds.
    Assembly Print - Essentially the manufacturer’s blueprint, it shows the location of the parts, as well as any information on special markings or packaging required for the PCB. Like the bare-board print, the assembly print should include the assembly part number and revision. Most commonly provided in a PDF document.

    Bill of Materials - (BOM) is the controlling document for components. At a minimum the BOM should have an internal part number, description, quantity per, and a reference designator for each line item. Often BOMs include the approved vendor list (AVL), eliminating the need for a separate AVL. Best-practice BOMs will include the fab part number and revision. BOMs are most commonly provided in Excel format. Please note, we will need separate drawings for any custom parts (i.e. cable assemblies, sheet metal, machining) to obtain pricing for these items.
     
    Tips: Practice Consistency – Make a standard format for your BOM that is easy to navigate and remains constant through every revision. The best file format to use is Excel, and it’s best to have a single line for each part number (called a ‘flat file’).
    Approved Vendor List - (AVL) provides the manufacturer and the manufacturer’s part number associated with your internal part number (IPN) or reference. There can be multiple approved manufacturers for each IPN. Commonly this information is included as part of the BOM.
     
    Tips: Keep Records of Previous Revisions - It’s important to keep documentation on all previous versions of your design.
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  6. The Chinese New Year is coming soon. 2015 will be the Year of the Goat. 
    The Goat is the eighth sign in Chinese astrology and number “8” is considered to be a very lucky number, which symbolizes wisdom, fortune and prosperity. 
    We would like to take this opportunity to say thank you for your support over the years and wish you and your family a new year filled with happiness and prosperity.

    The Chinese New Year holiday 2015 is from February 15 to February 26. All production may not be up and running the same day the holiday is over.
    As always all our efforts are focused on your PCB production and on time delivery. Please prioritize your most critical products and plan your production as early as possible.


    About Hampoo: Hampoo was founded in year 2003 as a high-tech enterprise which research, development and innovation for various electronic products, and devoted to be a global leading electronic product and service provider. Hampoo, base in Shenzhen, offers one stop electronic manufacturing service for customers, including PCB design, pcb fabrication, PCB assembly and pcb components sourcing. With over 12 years experience, Hampoo has gained a lot customers on the strength of excellent service and bespoke service.
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  7. At Hampoo, we are capable to produce the hard gold plating required for both contacts and gold fingers.

    The process begins after the copper etch with the PCBs tape laminated to leave only the desired area exposed. A nickel underlayer is electro-plated onto the PCB with a minimum thickness of 50 micro-inch. Nickel not only provides mechanical support, it also provides a diffusion barrier as well as an inhibitor to pore and creep corrosion. The 24 carat hard gold, immersed in a salt medium, is then electro-plated directly onto the nickel surface.

    Quality control for hard gold finishes includes thickness and tape adhesion tests. As you may expect, the price of gold requires solid process controls as the cost for errors would make even Auric shudder.

    A few design rules are required for gold fingers

    • No plated through holes are allowed in the plated area
    • No solder mask or silk screening can be present in the plated area
    • For panelization, always place gold fingers facing outward from the panel center
    • Connect all gold fingers with a 0.008” conductor trace at the edge to allow for manufacturing
    • Features can be placed on one or both sides to a depth of 25mm from the outside edge

    Having the capability to provide 24 carat hard gold PCB electroplating in-house not only ensures us to control over the process, it also allows us to significantly shorten the manufacturing lead time of quick turn PCBs when compared to subcontracting or outsourcing. 


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  8. In the high frequency domain, a signal or EM wave must propagate along the transmission path with uniform characteristic impedance. Whenever an impedance mismatch or discontinuity is encountered, a portion of the signal is reflected back to the transmitting end while remaining portion of the EM wave continues to travel to the receiving end. The severity of the signal reflection and attenuation depend on the magnitude of impedance discontinuity. When the magnitude of mismatched impedance increases, a larger portion of the signal is reflected and more attenuation or degradation of signal is observed at the receiver.
    The phenomenon of mismatched impedance is encountered at SMT pads of AC coupling (a.k.a DC blocking) capacitors, board to board connectors, and cable to board connector (e.g., SMA).
    In the case of SMT pad of AC coupling capacitor, as shown in Figure 1, a signal that travels along the PCB traces with 100 ohm differential impedance and 5 mils copper width, experiences an impedance discontinuity once it reaches the SMT pad with a wider copper (e.g., 30 mils width for 0603 package). This phenomenon is explained in Equation (2) and (1). The rise of copper’s cross sectional area or width increases the strip capacitance, which in turn causes capacitive discontinuity (i.e., negative surge) to the characteristic impedance of the transmission channel.
    In order to minimize the capacitive discontinuity, the reference plane area right under the SMT pads is cut out, and copper fill is constructed on the inner layer, as illustrated in Figure 2 and 3 respectively. This increases the distance between SMT pad and its reference or return path, which reduces the capacitive discontinuity. Micro stitching vias shall be inserted to provide electrical and physical connectivity between the original reference plane and the new reference copper on inner layer to have a proper signal return path to avoid EMI radiation issue.
    However, the distance “d” shall not be increased too much until strip inductance overrides strip capacitance and causes inductive discontinuity, as explained in Equation (3).


    Figure 1. Side view of PCB without plane cut-out



    Figure 2. Side view of PCB with plane cut-out


    Figure 3. Top view of PCB with plane cut-out

          
    C = strip capacitance (in pF)
    L = strip inductance (in nH)
    Zo = characteristic impedance (in ohm)
    ε = dielectric permittivity
    w = width of SMT pad
    l = length of SMT pad
    d = distance between SMT pad and reference plane underneath
    t = thickness of SMT pad

    The same concept is applicable to SMT pads of board to board (B2B) and cable to board (C2B) connectors, as shown in Figure 4 and 5 respectively.

    Figure 4. B2B connector
    Figure 5. C2B connector

    The proof of concept with analysis of TDR and insertion loss is presented in the subsequent section of this paper. The analysis is conducted by 3D modeling of SMT pad in EMPro software and subsequently being imported to Keysight ADS for simulation of TDR and insertion loss.

    Analyzing Effect of SMT Pad of AC Coupling Capacitor
    A 3D model of SMT with medium loss substrate is constructed in EMPro, where a pair of microstrip differential traces of 2 inches long and 5 mils wide in single ended mode, and 3.5 mils away from its reference plane enter the SMT pad of 30 mils wide at one end and exit it at another end. The copper area right under the SMT pads is cut out, the 3D model is shown in Figure 6.

    Figure 6. 3D model of SMT pad with cut-out on reference plane underneath

    The simulated plots of TDR and insertion loss are shown in Figure 7 and 8 respectively. SMT design without cut-out on reference plane causes impedance mismatch of 12Ω and insertion loss of -6.5dB at 20 GHz. Once cut-out is introduced to the reference plane area beneath the SMT pads, where “d” is set as 10 mils, the mismatched impedance improves to 2Ω and insertion loss of -3dB at 20GHz. Further increase of “d” causes strip inductance to override capacitance, results inductive discontinuity and in turn worsens the insertion loss (i.e., -4.5dB).

    Figure 7. Plot of simulated TDR

    Figure 8. Plot of simulated insertion loss

    Analyzing Effect of SMT Pad of B2B Connector
    A 3D model of SMT pad of B2B connector with pin pitch of 20 mils and pin width of 6mils, connected to a pair of microstrip differential traces of 5 inches long and 5 mils wide in single ended mode, and 3.5 mils away from its reference plane is constructed in EMPro. The thickness of SMT pad becomes 40 mils, inclusive of connector pin and solder, which is almost 40 times the thickness of the microstrip PCB trace.
    The capacitive discontinuity and higher signal attenuation are experienced when the copper thickness is increased. The phenomenon is shown in simulated plot of TDR and insertion loss in Figure 9 and 10 respectively. By cutting out the copper area right under the SMT pads with moderate “d” (i.e., 7 mils), impedance mismatch is minimized.

    Figure 9. Plot of simulated TDR

    Figure 10. Plot of simulated insertion loss
    Conclusion
    The analysis in this paper proves that insertion of a cut-out on the reference plane underneath the SMT pads reduces the impedance mismatch and increases the bandwidth of the transmission line. The distance between the SMT pad and its reference copper on an inner layer depends on the width of the SMT pad, and also the effective thickness of SMT pad inclusive of connector pin and solder. 3D modeling and simulation should be performed prior to PCB fabrication to ensure construction of a transmission channel with good signal integrity.

    References
    [1]  Eric Bogatin, “Signal Integrity-Simplified”, Prentice Hall, 2003
    [2]  Wave Reflection at an Impedance Discontinuity (includes animations)
    [5]  RF SMA, Samtec
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